Solder Paste Product Information for
Pb Water Soluble Solder Paste, 500g
Made with high-purity raw materials and extensively tested.
If your SMT process demands no-clean paste with low residues, extended tack time and excellent printability, Manncorp’s water soluble is the perfect choice. Ideal in difficult-to-solder applications, it is formulated for use with high temperature alloys, while offering superior humidity and slump resistance. The flux composition is completely water soluble enabling all residues to be removed after cleaning in DI water. Its formulation will not hamper long stencil life, and first print after wait is outstanding.
REFLOW PROFILE
SPECIFICATIONS:
HANDLING & STORAGE INSTRUCTIONS:
- 1. Ramp @ 1~3°C/sec to 120~170°C
- 2. Dwell @ 120~170°C for 60~120 sec
- 3. Ramp @ 1~3°C/sec to 210~230°C peak temperature
Temp. over 200°C for 30~60 sec - 4. Ramp down to room temperature @ 1~3°C/sec
SPECIFICATIONS:
- Alloy: Sn63/Pb37
- Melting point: 183°C
- Particle size: +45µm 1% large, -20µm 10% less per IPC-TM-650, 2.2.14
- Powder shape: sphere
- Flux content: 11 ± 0.5wt%
- Halide content: 0 wt% (in flux )
- Viscosity: 200 ± 50 Pa.s (25±1°C, 10rmp,Malcom)
- Flux type: ORII0
- P/N SH6388WA
HANDLING & STORAGE INSTRUCTIONS:
- Store at 0 - 10°C.
- Shelf life: 6 months from production date (sealed jar).
- Keep out of direct sunlight.
PDF FILE LINKS
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P/N SH6388WAPb - SN63Water Soluble Solder Paste |
- Allow solder paste to reach room temperature of 23°C - 27ºC for 3 to 4 hours prior to use. Do not heat to raise temperature!
- Mix with plastic spatula or plastic putty knife for about 1 to 3 minutes before use.
- At first, add 1/3 jar of solder paste onto the stencil, do not add more than 1 jar.
- Add more solder paste a little at a time according to production procedure.
- To maintain the solder paste quality, make sure not to store fresh paste and used paste in the same sealed jar.
- Place all components to be mounted on printed circuit board between 4~6 hours.
- If printing is interrupted for more than one 1 hour, remove solder paste from stencil and return to jar.
- After continuously printing for 24 hours, remove solder paste from stencil.
- It is recommended to clean both sides of stencil every 4 hours manually to ensure printing quality.
- Paste can be stored for up to 30 days at room temperature (22~28°C). Recommended humidity is between 30~60%
- To clean up printed board and stencil, use isopropyl alcohol or IPA.
- Dispose of discarded paste in accordance with local and federal requirements.
- Reflow solder in accordance with appropriate datasheet
- Clean flux residue by normal industrial practice as soon as possible after reflow, not to exceed 24 hours
